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Solder Joint Reliability: Theory and Applications John H. Lau 1991 edition
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Solder Joint Reliability: Theory and Applications
John H. Lau
New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.
631 pages, 146 black & white illustrations, biography
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 31 de mayo de 1991 |
| ISBN13 | 9780442002602 |
| Editores | Van Nostrand Reinhold Inc.,U.S. |
| Páginas | 631 |
| Dimensiones | 155 × 235 × 34 mm · 975 g |
| Lengua | Inglés |
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