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Solder Joint Reliability: Theory and Applications John H. Lau Softcover reprint of the original 1st ed. 1991 edition
Solder Joint Reliability: Theory and Applications
John H. Lau
New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.
652 pages, 146 black & white illustrations, biography
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 23 de febrero de 2014 |
| ISBN13 | 9781461367437 |
| Editores | Springer-Verlag New York Inc. |
| Páginas | 631 |
| Dimensiones | 155 × 235 × 34 mm · 902 g |
| Lengua | Inglés |
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