Recomienda este artículo a tus amigos:
Heterogeneous Integrations John H. Lau 2019 edition
Precio
$ 164,49
sin IVA
Pedido desde almacén remoto
Entrega prevista 17 - 30 de jun.
Nuestros clientes opinan:
Añadir a tu lista de deseos de iMusic
Heterogeneous Integrations
John H. Lau
This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems.
368 pages, 300 Tables, color; 342 Illustrations, color; 44 Illustrations, black and white; XXII, 368
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 12 de abril de 2019 |
| ISBN13 | 9789811372230 |
| Editores | Springer Verlag, Singapore |
| Páginas | 368 |
| Dimensiones | 150 × 220 × 20 mm · 752 g |
Mas por John H. Lau
Mostrar todo
![Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Hardcover Book) [2023 edition] (2023)](https://imusic.b-cdn.net/images/item/original/161/9789811999161.jpg?john-h-lau-2023-chiplet-design-and-heterogeneous-integration-packaging-hardcover-book&class=scaled&v=1695532633)
![Cover for John H. Lau · Semiconductor Advanced Packaging (Hardcover Book) [2021 edition] (2021)](https://imusic.b-cdn.net/images/item/original/753/9789811613753.jpg?john-h-lau-2021-semiconductor-advanced-packaging-hardcover-book&class=scaled&v=1623687781)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Hardcover Book) [2020 edition] (2020)](https://imusic.b-cdn.net/images/item/original/190/9789811539190.jpg?john-h-lau-2020-assembly-and-reliability-of-lead-free-solder-joints-hardcover-book&class=scaled&v=1588376991)
![Cover for John H. Lau · Fan-Out Wafer-Level Packaging (Hardcover Book) [2018 edition] (2018)](https://imusic.b-cdn.net/images/item/original/834/9789811088834.jpg?john-h-lau-2018-fan-out-wafer-level-packaging-hardcover-book&class=scaled&v=1588376972)
![Cover for John H. Lau · Handbook Of Tape Automated Bonding (Hardcover Book) [1992 edition] (1992)](https://imusic.b-cdn.net/images/item/original/279/9780442004279.jpg?john-h-lau-1992-handbook-of-tape-automated-bonding-hardcover-book&class=scaled&v=1570666783)
![Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Hardcover Book) [1991 edition] (1991)](https://imusic.b-cdn.net/images/item/original/602/9780442002602.jpg?john-h-lau-1991-solder-joint-reliability-theory-and-applications-hardcover-book&class=scaled&v=1516985150)
Mere med samme udgiver
![Cover for Mycotoxins: A Global Challenge for Food Safety & Security - Mycotoxins (Hardcover Book) [2022 edition] (2026)](https://imusic.b-cdn.net/images/item/original/347/9789811065347.jpg?2026-mycotoxins-a-global-challenge-for-food-safety-security-mycotoxins-hardcover-book&class=scaled&v=1738063266)
![Cover for Ram Kumar Mishra · Government Performance Management: Experiences and Lessons for India - SpringerBriefs in Business (Paperback Book) [2022 edition] (2026)](https://imusic.b-cdn.net/images/item/original/647/9789811613647.jpg?ram-kumar-mishra-2026-government-performance-management-experiences-and-lessons-for-india-springerbriefs-in-business-paperback-book&class=scaled&v=1694194972)
![Cover for Kate Shaw · The Squander and Salvage of Global Urban Waterfronts (Paperback Book) [1st ed. 2024 edition] (2026)](https://imusic.b-cdn.net/images/item/original/469/9789811369469.jpg?kate-shaw-2026-the-squander-and-salvage-of-global-urban-waterfronts-paperback-book&class=scaled&v=1570219621)
Ver todo de John H. Lau ( Ej. Hardcover Book y Paperback Book )