Recomienda este artículo a tus amigos:
Chiplet Design and Heterogeneous Integration Packaging John H. Lau 2023 edition
Precio
$ 134,49
sin IVA
Pedido desde almacén remoto
Entrega prevista 19 de jun. - 2 de jul.
Nuestros clientes opinan:
Añadir a tu lista de deseos de iMusic
También disponible como:
Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
525 pages, 501 Illustrations, color; 42 Illustrations, black and white; XXII, 525 p. 543 illus., 501
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 29 de marzo de 2024 |
| ISBN13 | 9789811999192 |
| Editores | Springer Verlag, Singapore |
| Páginas | 525 |
| Dimensiones | 150 × 220 × 10 mm · 920 g |
Mas por John H. Lau
Mostrar todo![Cover for John H. Lau · Semiconductor Advanced Packaging (Paperback Book) [2021 edition] (2022)](https://imusic.b-cdn.net/images/item/original/784/9789811613784.jpg?john-h-lau-2022-semiconductor-advanced-packaging-paperback-book&class=scaled&v=1653589884)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Paperback Book) [2020 edition] (2021)](https://imusic.b-cdn.net/images/item/original/220/9789811539220.jpg?john-h-lau-2021-assembly-and-reliability-of-lead-free-solder-joints-paperback-book&class=scaled&v=1622167029)
![Cover for John H. Lau · Fan-Out Wafer-Level Packaging (Paperback Book) [Softcover Reprint of the Original 1st 2018 edition] (2018)](https://imusic.b-cdn.net/images/item/original/660/9789811342660.jpg?john-h-lau-2018-fan-out-wafer-level-packaging-paperback-book&class=scaled&v=1588376983)
![Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Paperback Book) [Softcover reprint of the original 1st ed. 1991 edition] (2014)](https://imusic.b-cdn.net/images/item/original/437/9781461367437.jpg?john-h-lau-2014-solder-joint-reliability-theory-and-applications-paperback-book&class=scaled&v=1516985150)
Mere med samme udgiver
![Cover for Mycotoxins: A Global Challenge for Food Safety & Security - Mycotoxins (Hardcover Book) [2022 edition] (2026)](https://imusic.b-cdn.net/images/item/original/347/9789811065347.jpg?2026-mycotoxins-a-global-challenge-for-food-safety-security-mycotoxins-hardcover-book&class=scaled&v=1738063266)
![Cover for Ram Kumar Mishra · Government Performance Management: Experiences and Lessons for India - SpringerBriefs in Business (Paperback Book) [2022 edition] (2026)](https://imusic.b-cdn.net/images/item/original/647/9789811613647.jpg?ram-kumar-mishra-2026-government-performance-management-experiences-and-lessons-for-india-springerbriefs-in-business-paperback-book&class=scaled&v=1694194972)
![Cover for Kate Shaw · The Squander and Salvage of Global Urban Waterfronts (Paperback Book) [1st ed. 2024 edition] (2026)](https://imusic.b-cdn.net/images/item/original/469/9789811369469.jpg?kate-shaw-2026-the-squander-and-salvage-of-global-urban-waterfronts-paperback-book&class=scaled&v=1570219621)
Ver todo de John H. Lau ( Ej. Hardcover Book y Paperback Book )