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Assembly and Reliability of Lead-Free Solder Joints John H. Lau 2020 edition
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Assembly and Reliability of Lead-Free Solder Joints
John H. Lau
527 pages, 250 Tables, color; 347 Illustrations, color; 251 Illustrations, black and white; XXI, 527
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 30 de mayo de 2021 |
| ISBN13 | 9789811539220 |
| Editores | Springer Verlag, Singapore |
| Páginas | 527 |
| Dimensiones | 150 × 220 × 10 mm · 942 g |
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