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Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science King-Ning Tu Softcover reprint of hardcover 1st ed. 2007 edition
Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science
King-Ning Tu
The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders.
370 pages, biography
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 19 de noviembre de 2010 |
| ISBN13 | 9781441922847 |
| Editores | Springer-Verlag New York Inc. |
| Páginas | 370 |
| Dimensiones | 155 × 235 × 20 mm · 539 g |
| Lengua | Inglés |
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