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Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science King-Ning Tu 2007 edition
Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science
King-Ning Tu
The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders.
370 pages, biography
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 22 de agosto de 2007 |
| ISBN13 | 9780387388908 |
| Editores | Springer-Verlag New York Inc. |
| Páginas | 370 |
| Dimensiones | 156 × 235 × 23 mm · 662 g |
| Lengua | Inglés |