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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits Sung Kyu Lim 2012 edition
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Sung Kyu Lim
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits.
570 pages, 134 black & white illustrations, 169 colour illustrations, 167 black & white tables
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 25 de noviembre de 2012 |
| ISBN13 | 9781441995414 |
| Editores | Springer-Verlag New York Inc. |
| Páginas | 560 |
| Dimensiones | 241 × 161 × 37 mm · 884 g |
| Lengua | Inglés |
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