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Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) Asme
Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
Asme
Explores the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Presents 76 papers from the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
648 pages
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 30 de mayo de 2022 |
| ISBN13 | 9780791885505 |
| Editores | American Society of Mechanical Engineers |
| Páginas | 648 |
| Dimensiones | 278 × 347 × 41 mm · 1,21 kg |
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