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Thermal Design of Liquid Cooled Microelectronic Equipment - ASME Press Book Series on Electronic Packaging Lian-Tuu Yeh
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Thermal Design of Liquid Cooled Microelectronic Equipment - ASME Press Book Series on Electronic Packaging
Lian-Tuu Yeh
Focuses on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analogue devices.
277 pages
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 31 de julio de 2019 |
| Fecha de lanzamiento original | 2020 |
| ISBN13 | 9780791861936 |
| Editores | American Society of Mechanical Engineers |
| Páginas | 277 |
| Dimensiones | 237 × 160 × 24 mm · 630 g |
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