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Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018) Asme
Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)
Asme
A printed collection of 62 full-length, peer-reviewed technical papers. Topics include Heterogeneous Integration: Micro-Systems With Diverse Functionality; Servers of the Future, IoT, and Edge to Cloud; Structural and Physical Health Monitoring; Power Electronics, Energy Conversion, and Storage; and Autonomous, Hybrid, and Electric Vehicles.
558 pages
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 30 de noviembre de 2019 |
| ISBN13 | 9780791851920 |
| Editores | American Society of Mechanical Engineers |
| Páginas | 558 |
| Dimensiones | 150 × 220 × 10 mm · 924 g (Peso (estimado)) |
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