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Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics Tong, Xingcun Colin, Ph.D. 2011 edition
Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics
Tong, Xingcun Colin, Ph.D.
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance.
550 pages, 26 black & white tables, biography
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 25 de febrero de 2013 |
| ISBN13 | 9781461427926 |
| Editores | Springer-Verlag New York Inc. |
| Páginas | 618 |
| Dimensiones | 236 × 243 × 31 mm · 884 g |
| Lengua | Inglés |
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