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High- / Mixed-Voltage Analog and RF Circuit Techniques for Nanoscale CMOS - Analog Circuits and Signal Processing Pui-In Mak 2012 edition
High- / Mixed-Voltage Analog and RF Circuit Techniques for Nanoscale CMOS - Analog Circuits and Signal Processing
Pui-In Mak
This book presents high-/mixed-voltage analog and radio frequency (RF) circuit techniques for developing low-cost multistandard wireless receivers in nm-length CMOS processes.
Marc Notes: Includes bibliographical references and index. Table of Contents: High /Mixed Voltage RF and Analog CMOS Circuits.- A Full Band Mobile TV LNA with Mixed Voltage ESD Protection in 90 nm CMOS.- A High Voltage Enabled Mobile TV RF Front End in 90 nm CMOS.- A Mixed Voltage Receiver Front End for Full Band Mobile TV in 65 nm CMOS."Jacket Description/Back: This book presents high-/mixed-voltage analog and radio frequency (RF) circuit techniques for developing low-cost multistandard wireless receivers in nm-length CMOS processes. Key benefits of high-/mixed-voltage RF and analog CMOS circuits are explained, state-of-the-art examples are studied, and circuit solutions before and after voltage-conscious design are compared. Three real design examples are included, which demonstrate the feasibility of high-/mixed-voltage circuit techniques. Provides a valuable summary and real case studies of the state-of-the-art in high-/mixed-voltage circuits and systems; Includes novel high-/mixed-voltage analog and RF circuit techniques from concept to practice; Describes the first high-voltage-enabled mobile-TVRF front-end in 90nm CMOS and the first mixed-voltage full-band mobile-TV Receiver in 65nm CMOS; Demonstrates the feasibility of high-/mixed-voltage circuit techniques with real design examples."Publisher Marketing: This book presents high-/mixed-voltage analog and radio frequency (RF) circuit techniques for developing low-cost multistandard wireless receivers in nm-length CMOS processes. It includes novel high-/mixed-voltage analog and RF circuit techniques.
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 20 de marzo de 2012 |
| ISBN13 | 9781441995384 |
| Editores | Springer-Verlag New York Inc. |
| Género | Aspects (Academic) > Science / Technology Aspects |
| Páginas | 146 |
| Dimensiones | 155 × 235 × 11 mm · 408 g |
| Lengua | Inglés |
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