Extreme Low-Power Mixed Signal IC Design: Subthreshold Source-Coupled Circuits - Armin Tajalli - Libros - Springer-Verlag New York Inc. - 9781441964779 - 27 de septiembre de 2010
En caso de que portada y título no coincidan, el título será el correcto

Extreme Low-Power Mixed Signal IC Design: Subthreshold Source-Coupled Circuits 2010 edition

Precio
$ 184,99
sin IVA

Pedido desde almacén remoto

Entrega prevista 23 de jun. - 10 de jul.
Añadir a tu lista de deseos de iMusic

También disponible como:

Design exibility and power consumption in addition to the cost, have always been the most important issues in design of integrated circuits (ICs), and are the main concerns of this research, as well.


Marc Notes: Includes bibliographical references and index. Table of Contents: 1. Introduction -- 1.1. Applications of Widely Adjustable Circuits and Systems -- 1.1.1. Performance Scalability and Requirements -- 1.2. Prior Art -- 1.2.1. Digital Circuits -- 1.2.2. Analog Circuits -- 1.3. Organization -- References -- 2. Subthreshold MOS for Ultra-Low Power -- 2.1. MOS Technology -- 2.2. Device Modeling -- 2.2.1. I-V Characteristics -- 2.2.2. Second Order Effects -- 2.3. Design Considerations in Subthreshold -- 2.3.1. PVT Variation -- 2.3.2. Matching -- 2.3.3. Noise -- 2.4. Ultra-Low-Power Design Using Subthreshold MOS -- 2.4.1. MOS Transistor Leakage Mechanisms -- 2.4.2. Leakage Reduction Techniques -- 2.5. Impacts of Variation on Subthreshold CMOS Operation -- 2.5.1. Noise Margin -- 2.5.2. Energy Consumption -- 2.5.3. Optimal Design with Technology Scaling -- 2.5.4. Supply Voltage and Threshold Voltage Scaling for Optimal Design -- References -- Part I. Scalable and Ultra-Low-Power Digital Integrated Circuits -- 3. Subthreshold Source-Coupled Logic -- 3.1. Introduction -- 3.2. Conventional SCL Topology -- 3.2.1. Circuit Topology -- 3.2.2. Tradeoffs in Design of Strong-Inversion SCL Gates -- 3.3. Ultra-Low-Power Source-Coupled Logic -- 3.3.1. High-Valued Load Device Concept -- 3.3.2. STSCL Gates -- 3.4. Design Issues and Performance Estimation -- 3.4.1. Power-Speed Tradeoffs in STSCL -- 3.4.2. Noise Margin -- 3.4.3. Replica Bias Circuit -- 3.4.4. Minimum Operating Current -- 3.4.5. Global Process and Temperature Variation -- 3.4.6. Effect of Mismatch on Delay -- 3.4.7. Minimum Supply Voltage -- 3.5. Experimental Results -- 3.5.1. Basic Building Blocks -- 3.5.2. Ring Oscillator and Frequency Divider -- 3.5.3. Multiplier Circuit -- 3.6. Conclusion -- References -- 4. STSCL Standard Cell Library Development -- 4.1. Introduction -- 4.2. Standard Cell Library -- 4.2.1. Background -- 4.2.2. Cell Types -- 4.2.3. Cell Layout -- 4.2.4. Characterization -- 4.2.5. LEF File -- 4.2.6. Template Generation -- 4.3. Design Strategies -- 4.3.1. Series-Parallel Tail Bias Transistors -- 4.3.2. Constant Area Scaling -- 4.4. Demonstration Circuits -- 4.4.1. FIR Filter Topology -- 4.4.2. Sample FIR Filter Demonstrator Circuit -- 4.5. Conclusion -- References -- 5. Subthreshold Source-Coupled Logic Performance Analysis -- 5.1. Introduction -- 5.2. Comparison with the CMOS Topology -- 5.2.1. Ultra-Low-Power Requirements -- 5.2.2. Power-Speed Tradeoff in STSCL -- 5.2.3. Performance Analysis of CMOS Logic Circuits -- 5.2.4. Performance Comparison -- 5.3. Performance Improvement Techniques -- 5.3.1. Compound Logic Style -- 5.3.2. Using Source-Follower Buffer -- 5.3.3. Pipelining Technique -- 5.4. Experimental Results -- 5.4.1. STSCL with Source-Follower Buffer -- 5.4.2. Pipelined Adder Chain -- 5.4.3. Pipelined Multiplier -- 5.5. Conclusions -- References -- 6. Low-Activity-Rate and Memory Circuits in STSCL -- 6.1. Introduction -- 6.2. Power Efficiency in Low Activity Rates -- 6.2.1. STSCL Topology Performance -- 6.2.2. CMOS Topology Performance -- 6.2.3. Comparison -- 6.3. Low-Leakage CMOS SRAMs -- 6.4. Low Stand-By Current STSCL Memory Cell -- 6.4.1. Circuit Topology -- 6.4.2. Device Sizing -- 6.4.3. Sense Amplifier -- 6.4.4. Leakage Current Detection -- 6.5. Experimental Results -- 6.6. Observations and Discussion -- References -- Part II. Scalable and Ultra-Low-Power Analog Integrated Circuits -- 7. Widely Adjustable Continuous-Time Filter Design -- 7.1. Introduction -- 7.2. Amplifier Design -- 7.2.1. Low Power Folded-Cascode Amplifier -- 7.2.2. Widely Adjustable Two-Stage Amplifier -- 7.3. Transconductor-C Filter Design -- 7.3.1. Proposed Biquadratic Filter Topology -- 7.3.2. Dynamic Range -- 7.3.3. Sixth Order gm-C Filter -- 7.4. MOSFET-C Filter Design -- 7.4.1. Circuit Topology -- 7.4.2. High-Valued Pseudo-Resistance -- 7.4.3. Dynamic Range -- 7.4.4. Second Order MOSFET-C Filter -- 7.5. Experimental Results -- 7.5.1. MOSFET-C Filter -- 7.5.2. gm-C Filter -- 7.5.3. Figure of Merit -- 7.6. Conclusion -- References -- 8. Scalable Folding and Interpolating ADC Design -- 8.1. Introduction -- 8.2. Previous Art -- 8.3. Folding and Interpolating Analog-to-Digital Converter -- 8.3.1. Basics -- 8.3.2. Building Blocks and Design Tradeoffs -- 8.4. Design of FAI ADC -- 8.4.1. Circuit Topology -- 8.4.2. Ultra Low Power Resistor Ladder -- 8.4.3. Comparator Circuit -- 8.4.4. Encoder -- 8.5. Simulation and Experimental Results -- 8.5.1. Encoder -- 8.5.2. FAI ADC Performance -- 8.6. Conclusion -- References -- 9. Widely Adjustable Ring Oscillator Based ? ? ADC -- 9.1. Introduction -- 9.2. Background -- 9.2.1. Dynamic Range -- 9.2.2. Improving the Resolution -- 9.3. Performance Scalability in Ring Oscillator Based ? ? ADCs -- 9.3.1. Frequency Domain Adjustability -- 9.3.2. Dynamic Range Adjustment -- 9.4. Top Level Design -- 9.4.1. Sources of Non-Ideality -- 9.4.2. Performance Analysis -- 9.5. Circuit Design -- 9.5.1. Ring Oscillator -- 9.5.2. Logic Circuit -- 9.5.3. Current-Mode Integrator -- 9.6. High Order Modulator Design -- 9.6.1. Analysis and Modeling -- 9.6.2. Behavioral Modeling -- 9.7. Simulations and Experimental Results -- 9.8. Conclusion and Discussion -- References -- 10. Wide Tuning Range PLL -- 10.1. Introduction -- 10.2. Wide Tuning Range PLLs -- 10.2.1. Background -- 10.2.2. Wide Tuning Range CPLL -- 10.2.3. Design Issues with Wide Tune PLLs -- 10.3. Circuit Design -- 10.3.1. Proposed PLL Topology -- 10.3.2. Ring Oscillator -- 10.3.3. Frequency Divider and Phase-Frequency Detector (PFD) -- 10.3.4. Transconductor -- 10.4. Simulation and Experimental Results -- 10.5. Conclusions -- References -- 11. Conclusions -- 11.1. Main Contributions -- 11.2. Perspectives -- References -- Index. Publisher Marketing: Design exibility and power consumption in addition to the cost, have always been the most important issues in design of integrated circuits (ICs), and are the main concerns of this research, as well. Energy Consumptions: Power dissipation (P ) and energy consumption are - diss pecially importantwhen there is a limited amountof power budgetor limited source of energy. Very common examples are portable systems where the battery life time depends on system power consumption. Many different techniques have been - veloped to reduce or manage the circuit power consumption in this type of systems. Ultra-low power (ULP) applications are another examples where power dissipation is the primary design issue. In such applications, the power budget is so restricted that very special circuit and system level design techniquesare needed to satisfy the requirements. Circuits employed in applications such as wireless sensor networks (WSN), wearable battery powered systems [1], and implantable circuits for biol- ical applications need to consume very low amount of power such that the entire system can survive for a very long time without the need for changingor recharging battery[2 4]. Using newpowersupplytechniquessuchas energyharvesting[5]and printable batteries [6], is another reason for reducing power dissipation. Devel- ing special design techniques for implementing low power circuits [7 9], as well as dynamic power management (DPM) schemes [10] are the two main approaches to control the system power consumption. Design Flexibility: Design exibility is the other important issue in modern in- grated systems."

Contributor Bio:  Leblebici, Yusuf Yusuf Leblebici is Director and Chair Professor of the Microelectronic Systems Laboratory at the Swiss Federal Institute of Technology in Lausanne (EPFL). He has previously worked as a faculty member at University of Illinois at Urbana-Champaign, at Istanbul Technical University, and at Worcester Polytechnic Institute (WPI), where he established and directed the VLSI Design Laboratory, and also served as a project director at the New England Center for Analog and Mixed-Signal IC Design. He is a co-author of more than 150 scientific articles and 3 textbooks.

Medios de comunicación Libros     Hardcover Book   (Libro con lomo y cubierta duros)
Publicado 27 de septiembre de 2010
ISBN13 9781441964779
Editores Springer-Verlag New York Inc.
Páginas 274
Dimensiones 152 × 229 × 19 mm   ·   625 g
Lengua Inglés  

Mere med samme udgiver