Allyson L. Hartzell

MEMS Reliability - MEMS Reference Shelf Allyson L. Hartzell 2011 edition

Marc Notes: Includes bibliographical references and index. Jacket Description/Back: Successfully bringing MEMS-based products to market hinges on engineering the component to have sufficient reliability for the intended application, yet the reliability and qualification methodology for MEMS based products is not widely understood. Companies that have a deep understanding of MEMS reliability because of specific high volume manufacturing experience generally view the details of a reliability program as a competitive advantage and are reluctant to share it. "MEMS Reliability" focuses on the reliability and manufacturability of MEMS at a fundamental product engineering level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (PoF), accelerated testing and lifetime prediction, design strategies for improving yield, design for reliability (DfR), packaging and testing. Drawing upon years of practical experience and using numerous examples and illustrative applications, Allyson Hartzell, Mark da Silva, and Herbert Shea cover: How to design & manufacture MEMS components for reliability by focusing on basic tools such as reliability statistics, CAD methodologies, FMEA, tools & instruments for failure analysis, and product development methodologies. The different types of failure modes for silicon and metal-based MEMS, including failures originating in the design and manufacturing phases, and in-use failures (electrical, mechanical, and environmental) and how to avoid them. The testing and qualification procedures for MEMS reliability and the specific test protocols for accelerating specific MEMS- failures, leading to enhanced reliability understanding and accurate lifetime prediction."MEMS Reliability" will be of interest to engineers, researchers, and product managers involved in the production and development, of MEMS who want to learn more about determining and improving product reliability and implementing such practices within their own organizations."The MEMS Reference Shelf is a series devoted to Micro-Electro-Mechanical Systems (MEMS), which combine mechanical, electrical, optical, or fluidic elements on a common microfabricated substrate to create sensors, actuators, and microsystems. This series, authored by leading MEMS practitioners, strives to provide a framework where basic principles, known methodologies, and new applications are integrated in a coherent and consistent manner."STEPHEN D. SENTURIA Massachusetts Institute of Technology, Professor of Electrical Engineering, Emeritus"Table of Contents: 1. Introduction: Reliability of MEMS -- References -- 2. Lifetime Prediction -- 2.1. Introduction -- 2.2. Mathematical Measures of Reliability -- 2.3. Reliability Distributions -- 2.3.1. Bathtub Curve -- 2.3.2. Exponential Distribution -- 2.3.3. Weibull Distribution -- 2.3.4. Lognormal distribution -- 2.3.5. Acceleration Factors -- 2.3.6. Lifetime Units -- 2.4. Case Studies -- 2.4.1. Texas Instruments Digital Mirror Device -- 2.4.2. Case Study: Analog Devices Accelerometer -- 2.4.3. Case Study: RF MEMS -- 2.5. Summary -- References -- 3. Failure Modes and Mechanisms: Failure Modes and Mechanisms in MEMS -- 3.1. Introduction -- 3.2. Design Phase Failure Modes -- 3.2.1. Functional Failure Modes -- 3.2.2. MEMS Material Failure Modes -- 3.2.3. Non-analyzed Conditions -- 3.3. Manufacturing Failure Modes -- 3.3.1. Front End Process Defects -- 3.3.2. Back End Process Failures -- 3.4. Summary -- References -- 4. In-Use Failures -- 4.1. Introduction -- 4.2. Mechanical Failure Modes -- 4.2.1. Fracture -- 4.2.2. Mechanical Shock Resistance -- 4.2.3. Vibration -- 4.2.4. Creep -- 4.2.5. Fatigue -- 4.3. Electrical Failure Modes -- 4.3.1. Charging in MEMS -- 4.3.2. Electrical Breakdown and ESD -- 4.3.3. Electromigration -- 4.4. Environmental -- 4.4.1. Radiation -- 4.4.2. Anodic Oxidation and Galvanic Corrosion of Silicon -- 4.4.3. Metal Corrosion -- 4.5. Conclusions -- References -- 5. Root Cause and Failure Analysis -- 5.1. Introduction -- 5.2. FMEA, Failure Mode and Effects Analysis -- 5.2.1. RPN (Risk Priority Number) Levels -- 5.2.2. RFMEA Example -- 5.3. Case Study of RFMEA Failure Mode -- 5.3.1. RFMEA Safeguard: Design for Reliability, Mirror Curvature Matching -- 5.3.2. RFMEA Safeguard: Test for Curvature -- 5.3.3. RFMEA Safeguard: Perform Accelerated Thermal Testing and Compare Radius of Curvature Change to Predictions -- 5.3.4. Implementation of RFMEA Learning into Production -- 5.4. Failure Analysis as a Tool for Root Cause -- 5.5. Analytical Methods for Failure Analysis -- 5.5.1. Laser Doppler Vibrometry (LDV) -- 5.5.2. Interferometry -- 5.5.3. Scanning Electron Microscopy (SEM) -- 5.5.4. Electron Beam Scatter Detector (EBSD) -- 5.5.5. Transmission Electron Microscopy (TEM) -- 5.5.6. Focused Ion Beam (FIB) -- 5.5.7. Atomic Force Microscopy (AFM) -- 5.5.8. Energy Dispersive X-ray Analysis (EDS, EDX, EDAX) -- 5.5.9. Auger Analysis -- 5.5.10. X-Ray Photoelectron Spectroscopy (ESCA/XPS) -- 5.5.11. Time of Flight Secondary Ion Mass Spectroscopy (TOFSIMS) -- 5.5.12. Fourier Transform Infrared Spectroscopy (FTIR) -- 5.6. Summary -- References -- 6. Testing and Standards for Qualification -- 6.1. Introduction -- 6.2. Testing MEMS -- 6.2.1. Classes of MEMS Devices -- 6.3. Test Equipment for MEMS -- 6.3.1. Shaker Table for Vibration Testing -- 6.3.2. Optical Testing for Deformable Mirrors -- 6.3.3. Dynamic Interferometry -- 6.3.4. MEMS Optical Switch Production Test System -- 6.3.5. Laser Doppler Vibrometer/Strobe Video System -- 6.3.6. SHiMMer (Sandia High Volume Measurement of Micromachine Reliability) -- 6.4. Quality Standards and Qualifications -- 6.4.1. Mil-Std-883 (Revision H is current) -- 6.4.2. Mil-Std-810 (Current Revision G) -- 6.4.3. Telcordia Standards -- 6.4.4. Automotive Standards -- 6.5. MEMS Qualification Testing -- 6.5.1. ADI Accelerometers for Airbag Deployment -- 6.5.2. Motorola MEMS Pressure Sensors -- 6.5.3. Example: Space and Military Qualification -- 6.6. Summary -- References -- 7. Continuous Improvement: Tools and Techniques for Reliability Improvement -- 7.1. The Yield-Reliability Connection -- 7.2. Yield Improvement Techniques -- 7.2.1. Design for Manufacturability (DfM) -- 7.2.2. Design for Test (DfT) -- 7.2.3. Process and Packaging Integration -- 7.2.4. Yield Modeling -- 7.3. Reliability Enhancement -- 7.3.1. Process Stability and Reproducibility -- 7.3.2. Product Qualification -- 7.4. Design for Reliability (DFR) -- 7.5. Summary -- References -- Subject Index. Publisher Marketing: The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.