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Design of 3D Integrated Circuits and Systems - Devices, Circuits, and Systems Sung Kyu Lim 1.º edición
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Design of 3D Integrated Circuits and Systems - Devices, Circuits, and Systems
Sung Kyu Lim
This book covers 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as
324 pages
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 30 de septiembre de 2020 |
| ISBN13 | 9780367655921 |
| Editores | Taylor & Francis Ltd |
| Páginas | 324 |
| Dimensiones | 232 × 156 × 27 mm · 496 g |
| Lengua | Inglés |
| Editor de series | Iniewski, Krzysztof (Redlen Technologies Inc., Canada.) |
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