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Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection - Wspc Series In Advanced Integration And Packaging
Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection - Wspc Series In Advanced Integration And Packaging
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 16 de febrero de 2024 |
| ISBN13 | 9789811277931 |
| Editores | World Scientific Publishing Co Pte Ltd |
| Páginas | 480 |
| Dimensiones | 150 × 220 × 20 mm · 840 g |
| Editor de series | Bar-cohen, Avram (Univ Of Maryland, Usa) |