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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces - Springer Theses Qingke Zhang 1st ed. 2016 edition
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces - Springer Theses
Qingke Zhang
This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions.
143 pages, 81 black & white illustrations, 34 colour illustrations, biography
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 16 de noviembre de 2015 |
| ISBN13 | 9783662488218 |
| Editores | Springer-Verlag Berlin and Heidelberg Gm |
| Páginas | 143 |
| Dimensiones | 155 × 235 × 15 mm · 442 g |
| Lengua | Alemán |