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Chemical-Mechanical Planarization of Semiconductor Materials - Springer Series in Materials Science M R Oliver Softcover reprint of hardcover 1st ed. 2004 edition
Chemical-Mechanical Planarization of Semiconductor Materials - Springer Series in Materials Science
M R Oliver
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
428 pages, biography
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 1 de diciembre de 2010 |
| ISBN13 | 9783642077388 |
| Editores | Springer-Verlag Berlin and Heidelberg Gm |
| Páginas | 428 |
| Dimensiones | 155 × 235 × 22 mm · 612 g |
| Lengua | Alemán |
| Editor | Oliver, M.R. |