Hardware and Software: Verification and Testing: Third International Haifa Verification Conference, HVC 2007, Haifa, Israel, October 23-25, 2007, Proceedings - Lecture Notes in Computer Science - Karen Yorav - Libros - Springer-Verlag Berlin and Heidelberg Gm - 9783540779643 - 1 de febrero de 2008
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Karen Yorav
Hardware and Software: Verification and Testing: Third International Haifa Verification Conference, HVC 2007, Haifa, Israel, October 23-25, 2007, Proceedings - Lecture Notes in Computer Science 2008 edition

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Marc Notes: Includes bibliographical references and index.; Also issued online. Table of Contents: Invited Talks.- Simulation vs. Formal: Absorb What Is Useful; Reject What Is Useless.- Scaling Commercial Verification to Larger Systems.- From Hardware Verification to Software Verification: Re-use and Re-learn.- Where Do Bugs Come from?.- HVC Award.- Symbolic Execution and Model Checking for Testing.- Hardware Verification.- On the Characterization of Until as a Fixed Point Under Clocked Semantics.- Reactivity in SystemC Transaction-Level Models.- Model Checking.- Verifying Parametrised Hardware Designs Via Counter Automata.- How Fast and Fat Is Your Probabilistic Model Checker? An Experimental Performance Comparison.- Dynamic Hardware Verification.- Constraint Patterns and Search Procedures for CP-Based Random Test Generation.- Using Virtual Coverage to Hit Hard-To-Reach Events.- Merging Formal and Testing.- Test Case Generation for Ultimately Periodic Paths.- Dynamic Testing Via Automata Learning.- Formal Verification for Software.- On the Architecture of System Verification Environments.- Exploiting Shared Structure in Software Verification Conditions.- Delayed Nondeterminism in Model Checking Embedded Systems Assembly Code.- A Complete Bounded Model Checking Algorithm for Pushdown Systems.- Software Testing.- Locating Regression Bugs.- The Advantages of Post-Link Code Coverage.- GenUTest: A Unit Test and Mock Aspect Generation Tool.

Medios de comunicación Libros     Paperback Book   (Libro con tapa blanda y lomo encolado)
Publicado 1 de febrero de 2008
ISBN13 9783540779643
Editores Springer-Verlag Berlin and Heidelberg Gm
Páginas 267
Dimensiones 155 × 235 × 18 mm   ·   430 g
Lengua Francés  
Editor Yorav, Karen

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