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Thermal Contact Conductance - Mechanical Engineering Series Chakravarti V. Madhusudana Softcover reprint of the original 2nd ed. 2014 edition
Thermal Contact Conductance - Mechanical Engineering Series
Chakravarti V. Madhusudana
The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations.
278 pages, 116 black & white illustrations, 17 colour illustrations, 42 colour tables, biography
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 23 de agosto de 2016 |
| ISBN13 | 9783319374284 |
| Editores | Springer International Publishing AG |
| Páginas | 260 |
| Dimensiones | 235 × 156 × 20 mm · 399 g |
| Lengua | Francés |
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