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Electronic Materials Innovations and Reliability in Advanced Memory Packaging - Springer Series in Reliability Engineering Chong Leong Gan
Electronic Materials Innovations and Reliability in Advanced Memory Packaging - Springer Series in Reliability Engineering
Chong Leong Gan
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 22 de julio de 2025 |
| ISBN13 | 9783031947940 |
| Editores | Springer International Publishing AG |
| Páginas | 178 |
| Dimensiones | 150 × 220 × 20 mm · 444 g |
| Lengua | Alemán |