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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics Jong-Hoon Lee
Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics
Jong-Hoon Lee
Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References
108 pages, X, 108 p.
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 31 de diciembre de 2007 |
| ISBN13 | 9783031005756 |
| Editores | Springer International Publishing AG |
| Páginas | 108 |
| Dimensiones | 190 × 235 × 12 mm · 240 g |
| Lengua | Inglés |