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Advanced Thermal Stress Analysis of Smart Materials and Structures - Structural Integrity Zengtao Chen 2020 edition
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Advanced Thermal Stress Analysis of Smart Materials and Structures - Structural Integrity
Zengtao Chen
This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.
304 pages, 10 Tables, color; 44 Illustrations, color; 60 Illustrations, black and white; X, 304 p. 1
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 19 de septiembre de 2020 |
| ISBN13 | 9783030252038 |
| Editores | Springer Nature Switzerland AG |
| Páginas | 304 |
| Dimensiones | 150 × 220 × 10 mm · 444 g |
| Lengua | Alemán |
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