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Advanced Thermal Stress Analysis of Smart Materials and Structures Chen 1st ed. 2020 edition
Advanced Thermal Stress Analysis of Smart Materials and Structures
Chen
This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.
304 pages, 10 Tables, color; 44 Illustrations, color; 60 Illustrations, black and white; X, 304 p. 1
| Medios de comunicación | Libros Book |
| Publicado | 19 de septiembre de 2019 |
| ISBN13 | 9783030252007 |
| Editores | Springer Nature Switzerland AG |
| Páginas | 304 |
| Dimensiones | 150 × 220 × 20 mm · 616 g |
| Lengua | Alemán |
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