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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing Seonho Seok Softcover Reprint of the Original 1st 2018 edition
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing
Seonho Seok
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 5 de enero de 2019 |
| ISBN13 | 9783030085612 |
| Editores | Springer Nature Switzerland AG |
| Páginas | 115 |
| Dimensiones | 150 × 220 × 10 mm · 185 g |
| Lengua | Alemán |
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