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Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes E Zschech 2005 edition
Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes
E Zschech
This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
508 pages, 72 black & white tables, biography
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 1 de septiembre de 2005 |
| ISBN13 | 9781852339418 |
| Editores | Springer London Ltd |
| Páginas | 508 |
| Dimensiones | 155 × 235 × 28 mm · 916 g |
| Lengua | Inglés |
| Editor | Mikolajick, Thomas |
| Editor | Whelan, Caroline |
| Editor | Zschech, Ehrenfried |