Heat Management in Integrated Circuits: On-chip and system-level monitoring and cooling - Materials, Circuits and Devices - Ogrenci-Memik, Seda (Associate Professor, Northwestern University, Electrical Engineering and Computer Science Department, USA) - Libros - Institution of Engineering and Technolog - 9781849199346 - 1 de diciembre de 2015
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Ogrenci-Memik, Seda (Associate Professor, Northwestern University, Electrical Engineering and Computer Science Department, USA)
Heat Management in Integrated Circuits: On-chip and system-level monitoring and cooling - Materials, Circuits and Devices

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This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.

304 pages

Medios de comunicación Libros     Hardcover Book   (Libro con lomo y cubierta duros)
Publicado 1 de diciembre de 2015
ISBN13 9781849199346
Editores Institution of Engineering and Technolog
Páginas 264
Dimensiones 245 × 165 × 20 mm   ·   589 g

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