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ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis ASM International
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ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis
ASM International
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
461 pages
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 30 de julio de 2022 |
| ISBN13 | 9781627084192 |
| Editores | A S M International |
| Páginas | 461 |
| Dimensiones | 286 × 231 × 31 mm · 1,15 kg |
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