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Lead Free Solder: Mechanics and Reliability John Hock Lye Pang 2012 edition
Lead Free Solder: Mechanics and Reliability
John Hock Lye Pang
Lead-free solders play a crucial role in the electronics industry. Featuring in-depth design and reliability information on lead-free deformation and failure analysis, this book covers a wide range of topics including advanced material mechanics theory.
175 pages, 21 black & white tables, biography
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 30 de octubre de 2014 |
| ISBN13 | 9781489991164 |
| Editores | Springer-Verlag New York Inc. |
| Páginas | 175 |
| Dimensiones | 155 × 235 × 10 mm · 272 g |
| Lengua | Inglés |