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Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development Way Kuo Softcover Reprint of the Original 1st Ed. 1998 edition
Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development
Way Kuo
420 pages, biography
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 14 de marzo de 2014 |
| ISBN13 | 9781461375968 |
| Editores | Springer-Verlag New York Inc. |
| Páginas | 420 |
| Dimensiones | 155 × 235 × 22 mm · 589 g |
| Lengua | Inglés |