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Advances in CMP Polishing Technologies Toshiro Doi
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Advances in CMP Polishing Technologies
Toshiro Doi
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.
330 pages, 1, black & white illustrations
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 1 de diciembre de 2011 |
| ISBN13 | 9781437778595 |
| Editores | William Andrew Publishing |
| Páginas | 328 |
| Dimensiones | 160 × 239 × 23 mm · 544 g |
| Lengua | Inglés |
| Editor | Doi, Toshiro (Professor of Manufacturing Processes, Department of Mechanical Engineering, Kyushu University, Japan) |
| Editor | Kurokawa, Syuhei |
| Editor | Marinescu, Ioan D. (Professor and Director, Precision Micromachining Center, The University of Toledo, Toledo, OH, USA) |
