Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A. - MRS Proceedings - - Libros - Cambridge University Press - 9781107408715 - 5 de junio de 2014
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A. - MRS Proceedings

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This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.

358 pages, black & white illustrations

Medios de comunicación Libros     Paperback Book   (Libro con tapa blanda y lomo encolado)
Publicado 5 de junio de 2014
ISBN13 9781107408715
Editores Cambridge University Press
Páginas 358
Dimensiones 152 × 229 × 19 mm   ·   568 g   (Peso (estimado))
Lengua Inglés  
Editor Lin, Qinghuang (IBM T J Watson Research Center, New York)
Editor Ryan, E. Todd
Editor Wu, Wen-li (National Institute of Standards and Technology, Maryland)
Editor Yoon, Do Yeung (Seoul National University)

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