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Electronic Packaging Materials and Their Properties - Electronic Packaging Pecht, Michael (University of Maryland, College Park, USA) 1.º edición
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Electronic Packaging Materials and Their Properties - Electronic Packaging
Pecht, Michael (University of Maryland, College Park, USA)
Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.
128 pages, 61 Tables, black and white
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 18 de diciembre de 1998 |
| ISBN13 | 9780849396250 |
| Editores | Taylor & Francis Inc |
| Páginas | 120 |
| Dimensiones | 150 × 220 × 20 mm · 354 g |
| Lengua | Inglés |
