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Air Cooling Technology for Electronic Equipment 1.º edición
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Air Cooling Technology for Electronic Equipment
Answers questions frequently asked by thermal and packaging engineers. Providing problem-solving analyses, this title covers theoretical, numerical, and experimental analyses, includes descriptions of 12 air cooling enhancement techniques, and discusses the limiting roles of heat transfer, fluid flow, and thermal coupling in electronic enclosures.
272 pages, 257 equations; 5 Halftones, black and white; 13 Tables, black and white
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 26 de abril de 1996 |
| ISBN13 | 9780849394478 |
| Editores | Taylor & Francis Inc |
| Páginas | 260 |
| Dimensiones | 150 × 220 × 20 mm · 640 g |
| Lengua | Inglés |
| Editor | Kim, Sung Jin |
| Editor | Lee, Sang Woo (Yonsei University, Gangwondu, KOREA) |
