M S Nakhla

Modeling and Simulation of High Speed VLSI Interconnects: A Special Issue of Analog Integrated Circuits and Signal Processing An International Journal Vol. 5, No. 1 M S Nakhla Reprinted from ANALOG INTEGRATED CIRCUITS AND SIGN edition

Marc Notes: Special issue of Analog integrated circuits and signal processing: an international journal, v.5, no.1, 1994Table of Contents: Guest Editors' Introduction; M. S. Nakhla, Q. J. Zhang. Efficient Transient Analysis of Nonlinearly Loaded Low-Loss Multiconductor Interconnects; I. Maio, S. Pignari, F. Canavero. A Simplified Synthesis of Transmission Lines with a Tree Structure; D. Zhou, S. Su, F. Tsui, D. S. Gao, J. S. Cong. An Interconnect Model for Arbitrary Terminations Based on Scattering Parameters; G. V. Devarayanadurg, M. Soma. Electromagnetic Analysis of Multiconductor Losses and Dispersion in High-Speed Interconnects; Ke Wu. Circuit Modelling of General Hybrid Uniform Waveguide Structures in Chiral Anisotropic Inhomogeneous Media; T. Dhaene, F. Olyslager, D. De Zutter. An Efficient, CAD-Oriented Model for the Characteristic Parameters of Multiconductor Buses in High-Speed Digital GaAs ICs; G. Ghione. Full-Wave Analysis of Radiation Effect of Microstrip Transmission Lines; Guangwen Pan, Jilin Tan. Optimizing VLSI Interconnect Model for SPICE Simulation; J. Poltz. Statistical Simulation and Optimization of High-Speed VLSI Interconnects; Qi-jun Zhang, M. S. Nakhla. Publisher Marketing: This text brings together contributions and state-of-the-art research results in this rapidly advancing area. It should serve as a useful reference, providing insight into some of the most important issues in the field.