Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing and Software Development - Way Kuo - Libros - Kluwer Academic Publishers - 9780792381075 - 31 de enero de 1998
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Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing and Software Development 1998 edition

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Explains reliability issues in microelectronics systems manufacturing and software development with an emphasis on evolving manufacturing technology for the semiconductor industry. This book presents ways to systematically analyze burn-in policy at the component, sub-system, and system levels.


420 pages, biography

Medios de comunicación Libros     Hardcover Book   (Libro con lomo y cubierta duros)
Publicado 31 de enero de 1998
ISBN13 9780792381075
Editores Kluwer Academic Publishers
Páginas 420
Dimensiones 156 × 234 × 23 mm   ·   734 g
Lengua Inglés  

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