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Benefiting from Thermal and Mechanical Simulation in Micro-electronics O De Saint Leger
Benefiting from Thermal and Mechanical Simulation in Micro-electronics
O De Saint Leger
Presents papers from the international conference on this topic, EuroSimE2000. This book discusses thermal and mechanical related problems and challenges in micro-electronics. It is useful for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
192 pages, biography
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 31 de diciembre de 2000 |
| ISBN13 | 9780792372783 |
| Editores | Kluwer Academic Publishers |
| Páginas | 192 |
| Dimensiones | 155 × 235 × 12 mm · 498 g |
| Lengua | Inglés |
| Editor | Ernst, L.j. |
| Editor | Leger, O.de Saint |
| Editor | Zhang, G.q |