Recomienda este artículo a tus amigos:
Quality Conformance and Qualification of Microelectronic Packages and Interconnects M Pecht
Precio
$ 182,49
sin IVA
Pedido desde almacén remoto
Entrega prevista 17 de jun. - 6 de jul.
Nuestros clientes opinan:
Añadir a tu lista de deseos de iMusic
Quality Conformance and Qualification of Microelectronic Packages and Interconnects
M Pecht
All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifted.
462 pages, Illustrations
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 13 de diciembre de 1994 |
| Fecha de lanzamiento original | 1995 |
| ISBN13 | 9780471594369 |
| Editores | John Wiley & Sons Inc |
| Páginas | 496 |
| Dimensiones | 155 × 236 × 31 mm · 889 g |
| Editor | Dasgupta, Abhijit (University of Maryland, USA) |
| Editor | Evans, Jillian Y. (NASA Goddard Space Flight Center Facility in Greenbelt, MD, USA) |
| Editor | Evans, John W. (NASA Headquarters in Washington, D.C.) |
| Editor | Pecht, Michael G. (University of Maryland, USA) |
