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Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) 2.º edición
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Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications
Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University)
498 pages
| Medios de comunicación | Libros Paperback Book (Libro con tapa blanda y lomo encolado) |
| Publicado | 11 de octubre de 2018 |
| ISBN13 | 9780128119785 |
| Editores | William Andrew Publishing |
| Páginas | 508 |
| Dimensiones | 151 × 229 × 24 mm · 675 g |
| Editor de series | Licari, James J. (AvanTeco, Whittier, CA, USA) |
