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More-than-Moore Devices and Integration for Semiconductors 2023 edition
More-than-Moore Devices and Integration for Semiconductors
This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources.
260 pages, XIV, 260 p.
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 18 de febrero de 2023 |
| ISBN13 | 9783031216091 |
| Editores | Springer International Publishing AG |
| Páginas | 260 |
| Dimensiones | 150 × 220 × 20 mm · 582 g |
| Lengua | Alemán |
| Editor | Balestra, Francis |
| Editor | Iacopi, Francesca |